时    间：2013年6月25日（星期二）13:30-16:00

地    点：中国传感网国际创新园E栋1楼（暂定，根据参会人数调整）

参与对象：美彩国际 全体研发人员和其他感兴趣的同事

主办单位：7709美彩国际-官网美彩国际平台入口

支持单位：先进封装技术联合体

活动议程：

附件一：

【讲座概要】

Low Temperature Bonding for 3D Integration- A Review of the Surface Activated Bonding (SAB)

Advanced methods for low temperature bonding with surface activation and their development for 3D integration are reviewed. A new method for room temperature bonding is introduced, which can bond inorganic materials such as Si oxides,glass and sapphire to each other as well as to polymer films. The method is based on surface activated bonding (SAB) with some modifications including the formation of a Fe nano-adhesion layer accompanied by an additional Si intermediate layer formed by a special ion beam source. It was found that wafers of such materials can be bonded very strongly at room temperature without any heat treatment. The method can be applied also to polymer topolymer bonding without any organic adhesives.

【主讲人简介】

Tadatomo SUGA joined the Max-Planck Institut für Metallforschung in 1979, and received the Ph.D.degree in materials science from University of Stuttgart in 1983. Since 1984 he has been a faculty member of the University of Tokyo, and since 1993, he has been a professor at the Department of Precision Engineering of the School of Engineering. He was also the director of Research Group of Interconnect Ecodesign at National Institute of Materials Science (NIMS), and a Member of Japan Council of Science, as well as the chair of IEEE CPMT Society Japan Chapter. His researches focus on micro-systems integration and packaging, and development of interconnect technology, especially the room temperature bonding technique for 3D integration. He has endeavored to establish collaboration between industries and academia for the packaging technology, directing R&D project of the Institute of Micro-System Integration (IMSI), and advocating also importance of the environmental aspects of packaging technology as the key organizer of Japanese roadmap of lead-free soldering and International Eco-design Conference as well as the general chair of IEEE Workshop on LowTemperature Bonding for 3D integration.