中文
English- •Characterization of the Hamamatsu VUV4MPPCs for nEXO, Nuclear Inst. And Methods in Physics Research, A,2019
- •Warpage Prediction and Optimization for Embedded Silicon Fan Out (eSiFO) Wafer Level Packaging based on an Extended Theoretical Model,IEEE Transactions on Components, Packaging and Manufacturing Technology ，Volume: 9 , Issue: 5，2019.3
- •Imaging individual Ba atoms in solid xenon for barium tagging in nEXO, Nature, vol 569,2019.5
- •Three-dimensional force-field microscopy with optically levitated microspheres, PHYSICAL REVIEW A 99, 023816 (2019) IF=2.925.
- •Sensitivity and discovery potential of the proposed nEXO experiment to neutrinoless double-beta decay, PHYSICAL REVIEW C, 2018，Journal Volume: 97; Journal Issue: 6; Journal ID: ISSN 2469-9985
- •Characterization of an Ionization Readout Tile for nEXO, Journal of Instrumentation,2018
- •Study of silicon photomultiplier performance in external electric fields, JOURNAL OF INSTRUMENTATION, 13，2018.9
- •VUV-Sensitive Silicon Photomultipliers for Xenon Scintillation Light Detection in nEXO, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, VOL. 65, NO. 11, NOVEMBER 2018
- •Design of a silicon-based wideband bandpass filter using aggressive space mapping. IEICE Electronics Express. 2018; 15(21)
- •Design of a K-band two-layer microstrip interdigital filter exploiting aggressive space mapping. Journal of Electromagnetic Waves and Applications. 2018; 32(17):2281-2291.
- •Design and Implementation of a Compact 3-D Stacked RF Front-End Module for Micro Base Station, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018 (99): 1-12.
- •Warpage simulation and experimental verification for 320mm×320mm panel level fan-out packaging based on die-first process, Microelectronics Reliability, 83(29-38), 2018.2.14
- •Design and Verification of Sub-6GHz RoF Transceiver Employing LR4 TOSA and ROSA Packaging Structure, Microwave and Optical Technology Letters, 2018
- •Study on Magnetic Probe Calibration in Near-field Measurement System for EMI Application, Journal of Electronic Testing, 06, 2017
- •Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps, Journal of Materials SCIence: Materials in Electronics, 2017.
- •Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate, Microelectronics Reliability, 79, 38-47, 2017
- •Experimental and Numerical Study of 3D Stacked Dies under Forced Air Cooling and Water Immersion, Microelectronics Reliability, 74, 34–43, 2017
- •Design and fabrication of a small-form transmitter optical subassembly for 100Gbps short reach optical interconnect, Microwave and Optical Technology Letters, 59(12), 3181-3185, 2017
- •A wet etching approach for the via-reveal of a wafer with through silicon vias, Microelectronic Engineering, 179:31-36, 2017
- •Design and implementation of a rigid-flex RF front-end System-in-Package, Microsystem Technologies, 23(10), 4579–4589, 2017
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