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09-27

2019

Design and implementation of a rigid-flex RF front-end System-in-Package, Microsystem Technologies, 23(10), 4579–4589, 2017
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09-27

2019

Design and implementation of a high-coupling and multi-channel optical transceiver with a novel packaging structure, IEEE TRANSACTIONS ON COMPONENTS,PACKAGING AND MANUFACTURING TECHNOLOGY, 7(11), 1882 – 1890,2017
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09-27

2019

Fabrication and performance analysis of a high-coupling-efficiency and convenient-integration optical transceiver, Optoelectronics Letters, 13(4), 0250-0253, 2017
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09-27

2019

Experimental Verification and Optimization Analysis of Warpage for Panel Level Fan-out Package IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(10), 1721-1728, 2017
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09-27

2019

A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology, Applied Physics Letters, 109(2),023512-1/023512-5,2016.
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09-27

2019

Stress analysis and parametric studies for a ultralow-k chip in the flip chip process，Microelectronics Reliability, 65, 198-204, 2016
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09-27

2019

Thermal stress analysis of the low-k layer in a flip-chip package, Microelectronic Engineering, 163, 78–82, 2016
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09-27

2019

Silicon interposer process development for advanced system integration, J. Microelectronic Engineering, 156, 50-54, 2016
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09-27

2019

Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate, Microelectronics Reliability, 65, 98-107, 2016
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09-27

2019

Research on Optical Transmitter and Receiver Module Used for High Speed Interconnection between CPU and Memory Fiber and Integrated Optics, 35(5), 18, 2016
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江苏省产业技术研究院
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